 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| STK822 N-channel 25 V - 0.00175 - 38 A - PolarPAK(R) STripFETTM Power MOSFET Features Type STK822 VDSS 25 V RDS(on) max <0.00215 RDS(on)*Qg 58 nC*m PTOT 5.2 W Ultra low top and bottom junction to case thermal resistance Very low on resistance 100% Rg tested Fully encapsulated die 100% matte tin finish (in compliance with the 2002/95/EC european directive) PolarPAK(R) is a registered trademark of VISHAY Figure 1. Internal schematic diagram PolarPAK(R) Application Switching applications Description This Power MOSFET is the latest development of STMicroelectronics unique "single feature size" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, moreover the double sides cooling package with ultra low junction to case thermal resistance allows to handle higher levels of current. Table 1. Device summary Order code STK822 Marking K822 Package PolarPAK(R) Packaging Tape & reel Bottom View Top View February 2008 Rev 5 1/15 www.st.com 15 Contents STK822 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 4 5 Test circuits .............................................. 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/15 STK822 Electrical ratings 1 Electrical ratings Table 2. Symbol VDS VGS (1) VGS(2) ID (4) ID (4) IDM (3) PTOT (4) Absolute maximum ratings Parameter Drain-source voltage (VGS = 0) Gate-source voltage Gate-source voltage Drain current (continuous) at TA = 25 C Drain current (continuous) at TA = 100 C Drain current (pulsed) Total dissipation at TA = 25 C Derating factor Value 25 16 18 38 23.75 152 5.2 0.0416 500 -55 to 150 Unit V V V A A A W W/C mJ C EAS (5) Tj Tstg Single pulse avalanche energy Operating junction temperature Storage temperature 1. Continuous mode 2. Guaranteed for test time 15 ms 3. Pulse width limited by package 4. When mounted on FR-4 board of 1inch2 , 2 oz Cu and 10 sec 5. Starting Tj = 25 C, ID = 19 A, VDD = 25 V Table 3. Symbol Rthj-amb(1) Rthj-c(2) Rthj-c(3) Thermal data Parameter Thermal resistance junction-amb Thermal resistance junction-case (top drain) Thermal resistance junction-case (source) Typ. 20 0.8 2.2 Max. 24 1 2.7 Unit C/W C/W C/W 1. When mounted on FR-4 board of 1inch2 , 2 oz Cu and 10 sec 2. Steady state 3. Measured at Source pin when the device is mounted on FR-4 board in steady state 3/15 Electrical characteristics STK822 2 Electrical characteristics (TCASE=25 C unless otherwise specified) Table 4. Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) On/off Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 1 mA, VGS= 0 VDS = 20 V VDS = 20 V, Tc = 125 C VGS = 16 V VDS= VGS, ID = 250 A VGS= 10 V, ID= 19 A VGS= 4.5 V, ID= 19 A 1 Min. 25 1 10 100 Typ. Max. Unit V A A nA V 2.5 0.00175 0.00215 0.0022 0.003 Table 5. Symbol Ciss Coss Crss Qg Qgs Qgd Qgs1 Qgs2 Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Pre Vth gate-to-source charge Post Vth gate-to-source charge Gate input resistance Test conditions Min. Typ. 6060 1366 136 33 13.2 11.3 8 5.2 Max. Unit pF pF pF nC nC nC nC nC VDS = 25 V, f=1 MHz, VGS=0 VDD=12.5 V, ID = 38 A VGS = 4.5 V (see Figure 14) VDD=12.5 V, ID = 12 A VGS = 4.5 V (see Figure 19) f=1 MHz Gate DC Bias = 0 Test signal level = 20 mV open drain RG 1.1 4/15 STK822 Electrical characteristics Table 6. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Test conditions VDD= 12.5 V, ID = 19 A, RG = 4.7 , VGS = 4.5 V (see Figure 16) VDD=15 V, ID= 19 A, RG = 4.7 , VGS= 4.5 V (see Figure 16) Min. Typ. 30.7 60 Max. Unit ns ns Turn-off delay time Fall time 43.5 13 ns ns Table 7. Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD= 19 A, VGS=0 ISD= 38 A, di/dt = 100 A/s, VDD= 20 V, Tj = 150 C (see Figure 15) 41 45 2.2 Test conditions Min. Typ. Max. 38 152 1.2 Unit A A V ns nC A 1. Pulse width limited by package 2. Pulsed: pulse duration = 300s, duty cycle 1.5% 5/15 Electrical characteristics STK822 2.1 Figure 2. Electrical characteristics (curves) Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Normalized BVDSS vs. temperature Figure 7. Static drain-source on resistance HV41090 RDS(on) (m) 4 3 2 1 5 10 15 20 25 30 35 ID(A) 6/15 STK822 Figure 8. Gate charge vs gate-source voltage Figure 9. Electrical characteristics Capacitance variations Figure 10. Normalized gate threshold voltage vs temperature Figure 11. Normalized on resistance vs temperature Figure 12. Source-drain diode forward characteristics 7/15 Test circuits STK822 3 Test circuits Figure 14. Gate charge test circuit Figure 13. Switching times test circuit for resistive load Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test switching and diode recovery times circuit Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform 8/15 STK822 Figure 19. Gate charge waveform Id Vds Vgs Test circuits Vgs(th) Qgs1 Qgs2 Qgd 9/15 Package mechanical data STK822 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/15 STK822 Package mechanical data Table 8. Ref. PolarPAK(R) (option "L") mechanical data mm Min. Typ. 0.80 Max. 0.85 0.05 0.48 0.41 2.19 0.89 0.23 0.20 6 5.74 5.01 4.75 0.23 0.45 0.31 0.45 4.22 1.08 1.37 0.24 4.30 3.43 0.22 0.05 0.15 3.48 0.56 1.20 3.90 0.18 0 10 0.36 12 0 0.20 3.64 0.76 0.25 4.10 0.95 4.50 3.58 4.70 3.73 4.37 1.13 0.41 0.56 0.51 0.56 4.52 1.18 0.58 0.51 2.29 1.04 0.33 0.25 6.15 5.89 5.16 4.90 0.68 0.61 2.39 1.19 0.43 0.30 6.30 6.04 5.31 5.05 0.019 0.016 0.086 0.035 0.009 0.008 0.236 0.226 0.197 0.187 0.009 0.018 0.012 0.018 0.166 0.043 0.054 0.009 0.169 0.135 0.009 0.002 0.006 0.137 0.022 0.047 0.154 0.007 10 0.014 12 0.008 0.143 0.030 0.010 0.161 0.037 0.177 0.141 0.185 0.147 0.172 0.044 0.016 0.022 0.020 0.022 0.178 0.046 0.023 0.020 0.090 0.041 0.013 0.010 0.242 0.232 0.203 0.193 Min. 0.030 inch Typ. 0.031 Max. 0.033 0.002 0.027 0.024 0.094 0.047 0.017 0.012 0.248 0.238 0.209 0.199 A A1 b1 b2 b3 b4 b5 c D D1 E E1 H1 H2 H3 H4 K1 K2 K3 K4 M1 M2 M3 M4 P1 T1 T2 T3 T4 T5 < 0.75 11/15 Package mechanical data STK822 Figure 20. PolarPAK(R) (option "L") drawings 12/15 STK822 Figure 21. Recommended PAD layout Package mechanical data 13/15 Revision history STK822 5 Revision history Table 9. Date 14-May-2007 22-Jun-2007 03-Sep-2007 13-Dec-2007 14-Feb-2008 Document revision history Revision 1 2 3 4 5 First version VDSS value changed on all document Updated mechanical data Document status promoted from preliminary data to datasheet. Updated Table 8, Figure 20 and Figure 21 Changes 14/15 STK822 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 15/15 |
Price & Availability of STK822
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |